Proceedings of the 9th International Symposium on the Physical & Failure Analysis of Integrated Circuits

Proceedings of the 9th International Symposium on the Physical & Failure Analysis of Integrated Circuits

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The input for ANSYS can be the simplified bilinear model of the figure 10. ... geometric dimensions and manufacturing processes deviations which must be considered as random variables to evaluate solder joint fatigue life distributions [ 7]. ... 14 : Normalised probability density function (pdf) of ball sizes from process data.


Title:Proceedings of the 9th International Symposium on the Physical & Failure Analysis of Integrated Circuits
Author: IEEE Reliability/CPMT/ED Singapore Chapter, IEEE Electron Devices Society, IEEE Reliability Society, National University of Singapore. Centre for IC Failure Analysis & Reliability
Publisher: - 2002-08-01
ISBN-13:

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